IPC-T-50N: Terms and Definitions for Interconnecting and Packaging Electronic

IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing